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Bonding wire ( Cu )

Loại sản phẩm: Machinery & Equiment

Mã sản phẩm: Bonding wire ( Cu )

Nhà cung cấp: ANS Vietnam

Xuất Xứ: chính hãng

Hãng sản xuất: tomoe engineering Co.,Ltd

Giá : Vui lòng liên hệ

Description

Heraeus Copper Bonding Wire has been developed for ball/wedge bonding applications as an alternative to gold bonding wire.
 

Features

Copper Bonding Wire naturally provides higher mechanical strength, higher electrical & thermal conductivity than gold bonding wire. With a higher mechanical strength, it can provide better neck & heel strength, reduce wire sag & sway, and achieve excellent loop stability during encapsulation. In copper bonding applications, a protective gas is necessary to achieve stable and precise oxide-free balls.
Copper wire bonded on aluminum bond pad shows a reduction in the intermetallic growth, which results in lower electrical resistance, lower heat generation and extended bond life.

 

Others

The wire diameters Heraeus offers range from 0.7mil (18 m) to 4.0mil (100 m).

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